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散熱器

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Heat Sink Selection Guide
Thermal solutions cover a wide range of applications and devices and employ a variety of unique technologies. Start your heat sink search by finding either the device or application you need to cool or the product line you wish to use to cool it.

heatsinks
» Capabilities Brochure

Device Cooled	Product Line
	» Standard Electrical Packages
	Off-the-shelf cooling solutions for standard electrical packages, such as TO-220, TO-3, DIP, and many others. Copper and aluminum heat sinks.

	» Extrusion Profiles
	Use our selector to pinpoint the right extrusion from the many profiles available.

	» Surface Mount
	A line of low profile surface mount heat sinks suitable for SMT power semiconductors devices in D-PAK, D²PAK, D³PAK, and SO-10 packages.

	» Max Clips™
	Clip and rail thermal solutions for power transistors. A high performance, low cost way to eliminate mounting holes, screws, rivets, and thermal inefficiency.

	» Ball Grid Arrays (BGA)
	A family of BGA heat sinks offers a wide range of cooling solutions for motherboard, video card, and networking applications.

	» Liquid Cooled Cold Plates
	For high heat concentrations, HiContact™ assemblies offer a cost effective method of cooling.

	» DC to DC Converters
	Heat sinks designed to match popular DC to DC converter packages, extending their life and performance.

	» Options and Accessories
	A total thermal solution requires an appropriate surface finish, efficient thermal interface and means of mechanical attachment.

	» Electrolytic Capacitors
	Cap Coolers improve the performance and extend the life of 3" diameter electrolytic capacitors.

	» Bonded Fin Heat Sinks
	Bonded Fin technologies cool high power applications with high fin densities unavailable in extrusions.

	» IGBT Modules
	Choose from several options for cooling IGBT modules - cold plates, extrusions, bonded fin, and fan heat sinks.

	» Integrated Heat Pipe Assemblies
	Solutions for heat transport, spreading, or weight savings.

	» LED Light Sources
	Aavid's wide selection of standard heat sinks provides easy, fast access to cooling solutions for the new generation of LED light sources from Lumileds™.

	» Folded Fin Heat Sinks
	Folded Fin technology adds surface area to cool high power applications in a lightweight package. Folded fin assemblies offer maximum forced air cooling in a minimum volume.

	» Microprocessors
	Complete cooling solutions are available for popular microprocessors, including interface material and attachment methods. Copper Cpu heat sinks available.